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On April 12th, GAC officially launched 12 vehicle-grade chips, including C01, G-T01, and G-T02. These chips were developed in collaboration with companies such as ZTE Microelectronics, Yutai Microelectronics, Renxin Technology, Silergy, Jeeho, Yisaiwei, Jiehuat, Guoxin, and Meitai. They cover various applications in intelligent vehicle power management, braking, integrated security, and other domains.
The chips are designed to enhance the performance and safety of intelligent vehicles, providing advanced solutions for power management, braking systems, and integrated security. This launch marks a significant step forward in GAC's commitment to innovation and technological advancement in the automotive industry.
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